Stack-PCB design and midplane architecture
US11839054B1 · kind B1 · utility
0Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2021 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Oct 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A multi-board system for an electronic device that includes an heat spreader between at least two boards. In examples, the multi-board system may include a stack-PCB architecture on one side of the heat spreader and one or more boards on an opposite side of the heat spreader from the stack-PCB. The heat spreader may comprise a vapor chamber and/or include a graphite layer or core to transfer heat along a length of the heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.