Optical communication assembly and transceiver with stamped metal for heat dissipation and stamped heat dissipation component thereof
US11839056B2 · kind B2 · utility
2Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2021 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Jun 27, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4284
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An optical transceiver includes a housing, an optical communication module and a heat dissipation component. The optical communication module is disposed in the housing. The heat dissipation component is disposed in the housing and in thermal contact with the housing and the optical communication module, and the heat dissipation component is a stamped metal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.