Apparatus with housing having structure for radiating heat
US11839057B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2020 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Jan 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/03
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus with a housing having a structure for heat dissipation is provided. The apparatus includes the housing having at least one surface, outer walls, and a plurality of fins, and an operating unit fixed to the housing, wherein the at least one surface of the housing includes a fin cover connected to the fins, a base exposed in an internal space in which the operating unit is disposed, and a refrigerant filled in a space between the fin cover and the base, wherein the fin cover and the base are connected through the outer walls, and wherein the fin cover has a flat surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.