Heat transfer interfaces for circuit card assembly (CCA) modules
US11839061B2 · kind B2 · utility
0Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2022 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Apr 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/205
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.