Crack engineering as a new route for the construction of arbitrary hierarchical architectures
US11839998B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 23, 2020 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Dec 26, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2075/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Three-dimensional (3D) hierarchical morphologies widely exist in natural and biomimetic materials, which impart preferential functions including liquid and mass transport, energy conversion, and signal transmission for various applications. While notable progress has been made in the design and manufacturing of various hierarchical materials, the state-of-the-art approaches suffer from limited materials selection, high costs, as well as low processing throughput. Herein, by harnessing the configurable elastic crack engineering-controlled formation and configuration of cracks in elastic materials, an effect normally avoided in various industrial processes, the present invention provides a facile and powerful technique to enable the faithful transfer of arbitrary hierarchical structures with broad material compatibility and structural and functional integrity. The present invention provides a cost-effective, large-scale production method of a variety of flexible, inexpensive, and transparent 3D hierarchical and biomimetic materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.