Emulating parameters of a fluid ejection die
US11840075B2 · kind B2 · utility
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25References
17Claims
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Key dates
| Filing date | Jul 13, 2022 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Jul 13, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/04586
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An integrated circuit includes thermal tracking logic, control logic, and an output interface. The thermal tracking logic determines a temperature of a fluid ejection die. The control logic defines an emulated parameter of the fluid ejection die as a function of the temperature of the fluid ejection die. The output interface outputs the emulated parameter to a printer system based on the function and the temperature of the fluid ejection die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.