Thermoelectric cooling assembly
US11840095B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 6, 2021 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Jun 2, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/3358
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure provides a printer apparatus including a thermoelectric cooling assembly and a processor coupled to the thermoelectric cooling assembly. The thermoelectric cooling assembly includes a thermoelectric cooling element that includes a first substrate, a second substrate, and a first plurality of semiconductor elements electrically coupled to a second plurality of semiconductor elements in a space between the first substrate and the second substrate. The thermoelectric cooling element includes a base plate electrically coupled to the first substrate. The base plate is positioned proximate to a plurality of labels traversing above the thermoelectric cooling assembly. The processor receives sensor signals indicative of a temperature of a label that comes in contact with the thermoelectric cooling assembly, compares the temperature of the label with a threshold temperature, and generates an output signal indicative of current supplied to the thermoelectric cooling element to adjust the temperature of the thermoelectric cooling element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.