Method for producing banknotes including in each case at least one integrated circuit
US11840111B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2020 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Oct 20, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB42D25/46
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A method is provided for producing banknotes, which include, in each case, at least one integrated circuit. The banknotes are produced from a sheet or from a material web in a production panel. In at least a plurality of these banknotes, or in each of these banknotes, an aperture is created through their substrate. In each case, an integrated circuit is arranged in the relevant aperture. In a first method step, each of the integrated circuits to be arranged in one of the apertures is arranged, with respect to the intended position in each of the banknotes that include an aperture, in the correct position on a band-shaped foil, and, in the second method step, each of these integrated circuits is transferred from this band-shaped foil onto the relevant banknote. Owing to this transfer carried out in the second method step, one integrated circuit in each case, is arranged in the aperture created in the banknotes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.