MEMS sensor including a diaphragm and method for manufacturing a MEMS sensor
US11840445B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2019 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Nov 28, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/04
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS sensor including a diaphragm, a base surface area of the diaphragm being delimited with the aid of a peripheral wall structure, and the base surface area including at least two subareas, of which at least one of the subareas is deflectably situated, and the at least two subareas being separated from one another with the aid of at least one separating structure or being delimited by the latter. The separating structure includes at least one fluid through-opening for the passage of fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.