Low thermal expansion alloy having excellent low temperature stability and method for producing same
US11840752B2 · kind B2 · utility
0Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2020 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Feb 20, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Provided is a low thermal expansion alloy that contains, in mass %, not more than 0.015% of C, not more than 0.10% of Si, not more than 0.15% of Mn, 35.0-37.0% of Ni, and less than 2.0% of Co. Ni+0.8Co is 35.0-37.0%, and the remaining portion is Fe and unavoidable impurities. The low thermal expansion alloy has a solidification structure in which the secondary dendrite-arm spacing is 5 μm or less, has an average thermal expansion coefficient in a range of 0±0.2 ppm/° C. at 100° C. to −70° C., and has an Ms point of −196° C. or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.