Panel for forming a floor covering
US11840850B2 · kind B2 · utility
2Cited by
26References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2020 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Aug 11, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24868
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A panel including at least a substrate of thermoplastic material and a top layer with a printed decor and a translucent or transparent wear layer. The substrate has a thickness larger than one half of the thickness of the entire panel, and the substrate at least includes two layers, where the two layers each include thermoplastic material. A first one of the two layers further includes at least 60 percent by weight of filler materials and a second one of the two layers includes less fillers or is not filled, and is situated above the first one of the two layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.