Cutting elements with modified diamond surface
US11840891B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2019 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Oct 24, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/442
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Cutting elements include a carbonate diamond-bonded body that is sintered under HPHT conditions in the presence of a carbonate material, where the body includes a matrix phase of intercrystalline bonded diamond with interstitial regions including the carbonate material, where the diamond-bonded body is sintered without a substrate. A matrix casting is formed and mechanically coupled to the body after the body is sintered, and a portion of the body surface is exposed along a surface of the matrix casting. The exposed body surface is thereafter intentionally treated to induce a compressive residual surface stress that is greater than a remaining portion of the body. The compressive residual surface stress is less than about 500 MPa, and from about 100 to 500 MPa, and a remaining region the body may have a residual stress of less than about 300 MPa, and less than about 100 MPa.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.