Optical gyroscopes and methods of manufacturing of optical gyroscopes
US11841532B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2019 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Apr 27, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12173
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The disclosed structures and methods are directed to a chip for an optical gyroscope and methods of manufacturing of the chip for the optical gyroscope. The chip comprises a substrate, a waveguide having a first waveguide cladding layer and a waveguide core; and a ring resonator having a first ring cladding layer and a ring resonator core attached to the first ring cladding layer. A side wall of the ring resonator core forms an obtuse angle with an upper surface of the substrate. The method comprises depositing a first cladding layer on an upper surface of a silicon substrate; depositing a core layer; depositing a resist mask pattern to define a form of a ring resonator core and a form of a waveguide core; etching the core layer outside of the resist mask pattern; and stripping the resist mask pattern off.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.