IC assemblies including die perimeter frames suitable for containing thermal interface materials
US11842944B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2019 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Apr 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) assembly comprising an IC die and a frame material that has been dispensed over the assembly substrate to be further adjacent to a perimeter edge of the IC die. The frame material may be selected to have flow properties that minimize slump, for example so a profile of a transverse cross-section through the frame material may retain convex curvature. The frame material may be cured following dispense, and upon application of a thermal interface material (TIM), the frame material may and act as a barrier, impeding flow of the TIM. The frame material may be compressed by force applied through an external thermal solution, such as a heat sink, to ensure good contact to the TIM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.