Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure
US11842958B2 · kind B2 · utility
0Cited by
9References
23Claims
0Family size
Inventor
Key dates
| Filing date | Mar 18, 2022 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | May 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a multilayer wiring structure, including a plurality of dielectric layers, a plurality of conductive wiring layers interleaved with the plurality of dielectric layers, wherein the plurality of conductive wiring layers includes copper-phosphorous alloys (such as Cu3P).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.