Antenna-in-package transceiver module
US11843160B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2021 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Jul 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/38
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present disclosure describes aspects of an antenna-in-package (AiP) transceiver module and associated methods and systems. In aspects, an AiP transceiver module includes a substrate of dielectric material and first and second layers of conductive material disposed on respective surfaces of the substrate. The first layer of conductive material disposed on a first surface of the substrate includes an antenna element and antenna feed pad to which a contact of a transceiver integrated circuit die is coupled. The second surface of the substrate includes a dielectric interface area that is opposite to an area on the first surface of the substrate in which the antenna element is disposed and excludes the second layer of conductive material. The dielectric interface area of the substrate may effectively increase an amount of dielectric material below the antenna element, such that a volume of the dielectric material includes an air gap below the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.