Programmable two-dimensional simultaneous multi-beam optically operated phased array receiver chip and multi-beam control method
US11843417B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2023 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | May 19, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02A90/10
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A programmable two-dimensional simultaneous multi-beam optically operated phased array receiver chip is manufactured based on silicon-on-insulator (SOI) and indium phosphide (InP) semiconductor manufacturing processes, including the SiN process. The InP-based semiconductor is used for preparing a laser array chip and a semiconductor optical amplifier array chip, the SiN is used for preparing an optical power divider, and the SOI semiconductor is used for preparing a silicon optical modulator, a germanium-silicon detector, an optical wavelength multiplexer, a true delay line, and other passive optical devices. The whole integration of the receiver chip is realized through heterogeneous integration of the InP-based chip and the SOI-based chip. Simultaneous multi-beam scanning can be realized through peripheral circuit programming control. The chip not only can realize two-dimensional multi-beam scanning, but also has strong expansibility, such that the chip can be used for ultra-wideband high-capacity wireless communication and simultaneous multi-target radar recognition systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.