Flexible circuit board for multiple signal transmission
US11844173B2 · kind B2 · utility
0Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2021 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Sep 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0969
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a flexible circuit board for multiple signal transmission including a first dielectric layer; a plurality of first side grounds formed on one surface of the first dielectric layer to be parallel; first signal lines formed between the plurality of first side grounds; and a plurality of through holes which is formed in each of the plurality of first side grounds with an interval, along a length direction of the first side grounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.