Electromagnetic interference shielding in recesses of electronic modules
US11844200B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2020 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Oct 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1366
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Also disclosed is a process for making the above-specified electronic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.