Methods for manufacturing ultrasound transducers and other components
US11845108B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2020 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Aug 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0361
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.