Method of thermally transferring layers in a selective deposition-based additive manufacturing system using conductive heat
US11845221B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 1, 2019 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Mar 10, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y50/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed are selective deposition-based additive manufacturing systems (10) and methods for printing a 3D part (26). Layers of a powder material (22) are developed using one or more electrostatographic engines (12a-d). The layers (22) are transferred for deposition on a part build surface (88). For each of the layers (22), the part build surface (88) is pre-heated by impinging a first heat transfer liquid (74) toward the part build surface (88), for example using a solder fountain. The developed layer (22) is pressed into contact with the heated part build surface (88) to heat the developed layer (22) to a flowable state and form a new part build surface (88) which is fully consolidated. The new part build surface (88) is then rapidly cooled to remove the heat energy added during heating step before repeating the steps for the next developed layer (22).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.