Method for photocleavage of amide bonds
US11845708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2021 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Jan 28, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07K5/06165
- WIPO fieldBiotechnology
- WIPO sectorChemistry
Abstract
The present disclosure provides a method for photocleavage of an amide bond, the method has mild reaction conditions and can realize the cleavage of amide bonds by using light. The method comprises the following steps: subjecting 2,4-dinitrofluorobenzene to a reaction with an amino group of a substance represented by structural formula I with an α-amino acid at the end to produce a compound 1 represented by structural formula II; then under light irradiation, subjecting the compound 1 to a cleavage reaction of amide bond; Wherein, R1 is the side chain group of α-amino acid; R2 is: aryl, aliphatic hydrocarbon, —CH(R)—COOH or polypeptide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.