Method for producing thixotropic curable silicone composition
US11845869B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 21, 2019 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Jul 4, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/006
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method for producing a thixotropic curable silicone composition is provided. The curable silicone composition comprises: (A) a silicone base material comprising: an organopolysiloxane having at least two alkoxysilyl-containing groups per molecule and a filler other than fumed silica; (B) a hydrophobic fumed silica; (C) a carbasilatrane derivative; (D) an alkoxysilane or its partial hydrolysis and condensation product; and (E) a condensation reaction catalyst. The method comprises the following steps: (I) mixing components (A) and (B); (II) mixing component (C) with a mixture obtained by step (I); and (III) mixing components (D) and (E) with a mixture obtained by step (II) under free of moisture. The curable silicone composition obtained by the method has an excellent thixotropic property and can cure at room temperature by contact with moisture in air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.