Moisture curable polyurethane hot melt adhesive composition having low levels of diisocyanate monomer
US11845886B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2020 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Aug 17, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2170/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A moisture curable polyurethane hot melt adhesive composition and a process for making the same are disclosed. The moisture curable polyurethane hot melt adhesive composition includes an isocyanate-terminated polyurethane prepolymer that is the reaction product of a diisocyanate monomer component that includes at least 20% by weight asymmetrical diisocyanate monomer based on the weight of the diisocyanate monomer component and symmetrical diisocyanate monomer, at least one polyol having a number average molecular weight greater than 1000 g/mole, a monofunctional compound that includes one isocyanate-reactive group and has a molecular weight no greater than 400 g/mole, and a multifunctional compound that includes at least two isocyanate-reactive groups and has a molecular weight no greater than 400 g/mole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.