Diecut especially for permanently closing holes
US11845887B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2021 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Jul 20, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/006
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a diecut especially for the permanent closing of holes especially in metal sheets or in plastics parts, having a carrier composed of an assembly, more particularly laminate in the specified layer sequence, of optionally at least one first layer, which is formed by a metallic layer having a thickness of 10 to 40 μm, optionally at least one second layer, which is formed by a woven glass fabric or laid glass fabric having a basis weight of 30 to 200 g/m2, optionally at least one third layer, which is formed by a first pressure-sensitive adhesive having a basis weight of 70 to 200 g/m2, at least one fourth layer, which is formed by a flame-retardant foam having a thickness of at least 0.5 to 2.5 mm, and at least one fifth layer, which is formed by a second, acrylate-based pressure-sensitive adhesive having a basis weight of 300 to 1800 g/m2, preferably 360 to 1500 g/m2 and/or a thickness of 400 to 1800 μm, preferably 800 to 1500 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.