Patent · US Active

Diecut especially for permanently closing holes

US11845887B2 · kind B2 · utility

1Cited by
9References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 20, 2021
Grant dateDec 19, 2023
Priority date
Expiry dateJul 20, 2041

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2475/006
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

The present invention relates to a diecut especially for the permanent closing of holes especially in metal sheets or in plastics parts, having a carrier composed of an assembly, more particularly laminate in the specified layer sequence, of optionally at least one first layer, which is formed by a metallic layer having a thickness of 10 to 40 μm, optionally at least one second layer, which is formed by a woven glass fabric or laid glass fabric having a basis weight of 30 to 200 g/m2, optionally at least one third layer, which is formed by a first pressure-sensitive adhesive having a basis weight of 70 to 200 g/m2, at least one fourth layer, which is formed by a flame-retardant foam having a thickness of at least 0.5 to 2.5 mm, and at least one fifth layer, which is formed by a second, acrylate-based pressure-sensitive adhesive having a basis weight of 300 to 1800 g/m2, preferably 360 to 1500 g/m2 and/or a thickness of 400 to 1800 μm, preferably 800 to 1500 μm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.