Hot stamped component
US11846027B2 · kind B2 · utility
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3Claims
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Assignee
Inventors
Key dates
| Filing date | Mar 23, 2020 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Mar 23, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12972
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A hot stamped component, includes: a base material; and a Zn-based plating layer provided in contact with the base material as a layer above the base material and containing Zn. A base material side of the Zn-based plating layer is a Fe—Zn solid solution, and two or more twins exist in 10 crystal grains of the Fe—Zn solid solution adjacent to an interface between the base material and the Zn-based plating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.