In-ground sensor systems with modular sensors and wireless connectivity components
US11846624B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2022 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | May 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W4/38
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In an embodiment, an integrated sensor system with modular sensors and wireless connectivity components for monitoring properties of field soil is described. In an embodiment, an integrated sensor system comprises one or more sensors that are configured to determine one or more measures of at least one property of soil. The integrated sensor system also includes one or more processing units that are configured to receive, from the sensors, the measures of at least one property of soil and calculate soil property data based on the measures. The system further includes a transmitter that is configured to receive the soil property data from the processing units, establish a communications connection with at least one computer device, and automatically transmit the soil property data to the at least one computer device via the communications connection. In an embodiment, the communications connection is a wireless connection established between the transmitter and a smart hub or a LoRA-enabled device. In an embodiment, the computer sensors, the processors, and the transmitter are installed inside a portable probe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.