Array substrate, manufacturing method thereof, and display device
US11847850B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2021 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Mar 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6723
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An array substrate, a manufacturing method thereof, and a display device are provided. The array substrate includes a substrate, a metal electrode layer, a first passivation layer, a first electrode layer, a photosensitive semiconductor layer, a second passivation layer, and a second electrode layer. The first electrode layer and the photosensitive semiconductor layer are both disposed on a surface of the first passivation layer away from the metal electrode layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.