Short on wafer laser for heat assisted magnetic recording
US11848036B1 · kind B1 · utility
1Cited by
4References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 26, 2022 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Apr 26, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a substrate. A laser is deposited above the substrate. The laser includes one or more non-self-supporting layers of crystalline material. The laser has a length along a light path in a range of about 40 um to about 350 um. An optical input coupler is configured to receive light from the laser. A waveguide is deposited proximate the optical input coupler. The waveguide is configured to communicate light from the laser via the optical input coupler to a near-field transducer that directs energy resulting from plasmonic excitation to a recording medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.