Multilayer coil component and method for manufacturing same, as well as circuit board carrying multilayer coil component
US11848142B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Mar 20, 2020 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Feb 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/2809
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Magnetic layers of the multilayer coil component are constituted by: soft magnetic alloy grains 21 containing Fe, Si, and at least one of Cr and Al, as constituent elements; and an oxide layer 22 formed around the soft magnetic alloy grains to bond the soft magnetic alloy grains together, and also containing Si as well as at least one of Cr and Al as constituent elements, where the content of Si based on mass is higher than the total content of Cr and Al. The multilayer coil component can have a small thickness and offer excellent magnetic properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.