System for cooling a metal-ceramic substrate, a metal-ceramic substrate and method for manufacturing the system

US11848248B2 · kind B2 · utility

Assignee

• ROGERS GERMANY GMBH · DE

Inventors

• Andreas Meyer · Speichersdorf, DE
• Vitalij Gil · Hersbruck, DE
• László Müller · Allentown, US
• Rainer Herrmann · Hamburg, DE
• Stefan Britting · Schnaittach, DE

Key dates

• Filing date: May 14, 2019
• Grant date: Dec 19, 2023
• Expiry date: Jan 24, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K7/20927
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A system for cooling a metal-ceramic substrate (1) having a component side (5) and a cooling side (6) opposite the component side (5), comprising