Patent · US Active

Semiconductor component, motor vehicle, and method for producing a semiconductor component

US11848252B2 · kind B2 · utility

1Cited by

2References

5Claims

0Family size

Assignees

AUDI AG · DE
Hitachi Energy Switzerland AG · CH

Inventors

Thomas Gradinger · Aarau, CH
Daniele Torresin · Baden, CH

Key dates

Filing date	Apr 13, 2020
Grant date	Dec 19, 2023
Priority date	—
Expiry date	Sep 26, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L25/072
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor component, including a support frame and at least one semiconductor module attached to the support frame, wherein the support frame includes a respective passage (on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.