Control module, method for manufacturing same, and electronic device
US11848277B2 · kind B2 · utility
0Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2020 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Jul 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a control module including a printed circuit board, an IC, and a shielding cover. The shielding cover is provided with a dispensing hole for adhesive dispensing. The IC is soldered onto the printed circuit board, and an adhesive may be dispensed between the IC and the printed circuit board through the dispensing hole. A method for manufacturing a control module is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.