Adhesive layer application device for wearable hardware
US11850070B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2021 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Sep 4, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D83/0817
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An adhesive layer applicator for a body-mountable device is disclosed. The applicator includes a housing defining a first opening through which a chamber is accessible, and a plurality of adhesive layers and a plurality of adhesive liners alternately stacked on a floor that is movable within the chamber. The size and shape of the opening corresponds to the size and shape of the body-mountable device. The housing is configured to receive at least a portion of the body-mountable device through the opening. A second opening is formed in each adhesive layer in the plurality of adhesive layers and a gel is accommodated within the second openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.