Bondable microcapsules and surface functionalized fillers
US11850292B2 · kind B2 · utility
0Cited by
12References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2022 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Jul 29, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G18/8175
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A composition comprising microcapsules functionalized with polymerizable functional groups on the surface of said microcapsules wherein the functional groups form covalent bonds with monomers in the continuous phase to enhance the mechanical properties of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.