Patent · US Active

Method for manufacturing transparent heat-insulation building material based on waste wood

US11850768B2 · kind B2 · utility

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1References
8Claims
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Key dates

Filing dateJun 27, 2021
Grant dateDec 26, 2023
Priority date
Expiry dateJun 3, 2042

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB82Y30/00
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A method for manufacturing a transparent heat-insulation building material from waste wood is provided. The method includes the following steps of: step S1, wood pretreatment, drying immersing, heating, adding a complexing agent solution, stirring, then drying the wood; step S2, wood acetylation treatment, loading the wood into a pressure vessel, adding acetylation fluid, reducing the pressure, and then pressurizing and raising a temperature; step S3, resin impregnating, adding a methyl methacrylate monomer solution and heating it, adding the methyl methacrylate monomer and benzoyl peroxide, bleaching the wood by hydrogen peroxide, and placing them in a vacuum permeator to allow the prepolymer liquid to penetrate into the wood and collecting the prepolymer liquid; and step S4, hot press molding polymerizing the wood in an oven and sleeving it into a heat press molding to obtain a densified wood.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.