Electronic device having a component with crack hindering internal stress regions
US11850822B2 · kind B2 · utility
0Cited by
112References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2020 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Oct 2, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/208
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A component for an electronic device including an internal compressive stress region is disclosed herein. The internal compressive stress region may be created in a glass portion of the component or in a glass ceramic portion of the component. Electronic devices comprising the components and method for making the components are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.