Site-specific connecting of glass substrates

US11851366B2 · kind B2 · utility

Assignee

• LPKF LASER & ELECTRONICS AG · DE

Inventors

• Robin Krüger · Hannover, DE
• Roman Ostholt · Langenhagen, DE
• Norbert Ambrosius · Kevelaer, DE
• Oktavia Ostermann · Hannover, DE
• Bernd Rösener · Porta Westfalica, DE
• Daniel Dunker · Hannover, DE
• Arne Schnoor · Hannover, DE
• Malte Schulz-Ruhtenberg · Wunstorf, DE

Key dates

• Filing date: Jan 29, 2020
• Grant date: Dec 26, 2023
• Expiry date: Mar 20, 2040

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24347
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.