Low density syntactic foams via material extrusion additive manufacturing
US11851545B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Aug 17, 2020 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Sep 8, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W30/91
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An ink formulation for additive manufacturing of low density syntactic foams is described. The ink formulation can include a thermoset resin, a curing agent suitable for use with the thermoset resin, a plurality of hollow spheres, such as glass microballoons, one or more solvents, and one or more non-hollow, viscosity modifying filler. Also described are a method of preparing the ink formulation, a method of preparing three-dimensional objects comprising low density syntactic foams, and the three-dimensional objects prepared thereby.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.