Resin composition and article made therefrom
US11851562B2 · kind B2 · utility
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13Claims
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Assignee
Inventors
Key dates
| Filing date | Mar 17, 2022 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Apr 7, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes a polyphenylene ether resin of Formula (1) and an additive. The additive may include maleimide resin, unsaturated C═C double bond-containing crosslinking agent, polyolefin, flame retardant, filler, curing accelerator, or a combination thereof. An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including comparative tracking index, breakdown voltage, dissipation factor and copper foil peeling strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.