Composition and method for conducting a material removing operation
US11851586B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 7, 2022 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Oct 7, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01G45/1207
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A composition suitable for chemical mechanical polishing a substrate can comprise abrasive particles, a multi-valent metal borate, at least one oxidizer and a solvent. The composition can polish a substrate with a high material removal rate and a very smooth surface finish.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.