Thermally conductive composition and methods and devices in which said composition is used
US11851603B2 · kind B2 · utility
0Cited by
15References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 7, 2018 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Jan 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/42
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.