Systems and methods for foldable multi-mode bend sensors
US11852546B2 · kind B2 · utility
0Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2021 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Mar 2, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B7/22
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.