High-throughput optical sectioning imaging method and imaging system
US11852794B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2021 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Aug 11, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/1787
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A high-throughput optical sectioning imaging method and imaging system. The method includes: modulating a light beam into a modulated light beam capable of being focused on a focal plane of an objective lens and being defocused on a defocusing plane of the objective lens, the modulated light beam having incompletely identical modulated intensities on the focal plane of the objective lens; imaging, in different rows of pixels, a sample under illumination of the modulated light beam to obtain sample images in the different rows of pixels; obtaining focal plane images of sample images in the different rows of pixels by demodulation of the sample images according to a demodulation algorithm. The system includes a light beam modulation module, an imaging module and a demodulation module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.