Patent · US Active

Systems and methods for using wire printing process data to predict material properties and part quality

US11853033B1 · kind B1 · utility

2Cited by
66References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 20, 2020
Grant dateDec 26, 2023
Priority date
Expiry dateMay 17, 2042

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06T2207/30144
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

Disclosed herein are systems and methods for using printing process data to predict quality measures for three-dimensional (3D) printed objects and properties of the materials comprising the 3D objects. Printing may be performed using resistive or Joule printing. The system may include a computer communicatively coupled to a 3D printing apparatus, which may store printing parameters. The 3D printing apparatus may be able to take measurements during a print job, and record those measurements in memory. The 3D printing apparatus may also be able to record printing states before, during, and/or after printing. A combination of printing states, printing parameters, and measurements may be analyzed, for example, by a machine learning algorithm, in order to predict material properties and quality measures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.