Systems and methods for using wire printing process data to predict material properties and part quality
US11853033B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2020 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | May 17, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30144
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Disclosed herein are systems and methods for using printing process data to predict quality measures for three-dimensional (3D) printed objects and properties of the materials comprising the 3D objects. Printing may be performed using resistive or Joule printing. The system may include a computer communicatively coupled to a 3D printing apparatus, which may store printing parameters. The 3D printing apparatus may be able to take measurements during a print job, and record those measurements in memory. The 3D printing apparatus may also be able to record printing states before, during, and/or after printing. A combination of printing states, printing parameters, and measurements may be analyzed, for example, by a machine learning algorithm, in order to predict material properties and quality measures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.