Touch substrate and touch device
US11853500B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 12, 2021 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Jul 12, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04107
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A touch substrate includes: a substrate, which includes a touch area and a bonding area on one side of the touch area; and a plurality of pads on the substrate, wherein the plurality of pads are arranged in the bonding area at intervals, wherein the pad includes a first metal layer, a first organic layer and a second metal layer, arranged in this order on the substrate, a first via is formed in the first metal layer, a second via is formed in the first organic layer, an orthographic projection of the first via on the substrate and an orthographic projection of the second via on the substrate do not overlap, a part of the first organic layer is in the first via, and a part of the second metal layer is in contact with the first metal layer through the second via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.