Protective assembly and touch module
US11853516B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Dec 14, 2021 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Mar 17, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04111
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A protective assembly includes a cover plate, a buffer layer, and a flexible substrate. The buffer layer is disposed on the cover plate and made of transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness ranging from about 3 μm to about 15 μm, and a Poisson's ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and doped with an inorganic compound. The flexible substrate has a thickness ranging from about 3 μm to about 10 μm and a Young's coefficient ranging from about 1 GPa to about 10 GPa.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.