Head gimbal assembly with damping material
US11854583B2 · kind B2 · utility
0Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2021 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Mar 29, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B33/08
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosure describes a head gimbal assembly including a suspension and a damping layer on a surface of the suspension. The suspension may include a slider mount configured to establish mechanical communication with a slider and the layer may be displaced from the slider mount. The layer may be configured to provide passive damping or active damping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.