Patent · US Active

Method for producing an electrically conductive connection on a substrate, microelectronic device and method for the production thereof

US11855037B2 · kind B2 · utility

0Cited by

2References

12Claims

0Family size

Assignee

KARLSRUHER INSTITUT FÜR TECHNOLOGIE · DE

Inventors

Uwe Bog · Karlsruhe, DE
Michael Hirtz · Linkenheim-Hochstetten, DE
Harald Fuchs · Eisenberg (Pfalz), DE
Jasmin Aghassi · Karlsruhe, DE
Gabriel Cadilha Marques · Karlsruhe, DE
Subho Dasgupta · Blankenloch, DE
Ben Breitung · Jockgrim, DE
Horst Hahn · Champaign, US

Key dates

Filing date	Aug 22, 2019
Grant date	Dec 26, 2023
Priority date	—
Expiry date	Jul 20, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/82805
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a method (110) for producing an electrically conductive connection (112, 112′) on a substrate (114), comprising the following steps: The invention furthermore relates to a method for producing a microelectronic device (124) and to a microelectronic device (124), in particular a transistor (130).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.