Millimeter-wave assembly

US11855350B2 · kind B2 · utility

Assignee

• Huawei Technologies Co., Ltd. · CN

Inventors

• Jari Kristian Van Wonterghem · Sollentuna, SE
• Alexander Khripkov · Helsinki, FI
• Dong Liu · Nanhu, CN
• Janne Ilvonen · Helsinki, FI
• Jian Ou · Nanhu, CN
• Ruiyuan Tian · Helsinki, FI
• Changnian Xu · Nanjing, CN
• Wei Huang · Munich, DE
• Zlatoljub Milosavljevic · Helsinki, FI

Key dates

• Filing date: Feb 23, 2022
• Grant date: Dec 26, 2023
• Expiry date: Jul 14, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01Q21/28
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

A millimeter-wave (mmWave) assembly (1) comprising a first mmWave module (2), a second mmWave module (3), and a connector (4) configured to releasably interconnect the first mmWave module (2) and the second mmWave module (3). The connector (4) comprises a first connector element (5) associated with the first mmWave module (2). The first mmWave module (2) comprises a first substrate (7) and an mmWave radio frequency integrated circuit (RFIC) (8), and the second mmWave module (3) comprises a second substrate (9) and an mmWave antenna array (10). The connector (4) is configured to transmit at least one signal between the mmWave RFIC (8) and the mmWave antenna array (10) when the first mmWave module (2) and the second mmWave module (3) are interconnected.